ServerWorks ServerSet™ III HE-Super Lite

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Features Benefits
133 MHz Front Side Bus Capability
  • Supports 100 MHz and 133 MHz system bus for single and dual processor configurations
  • Significantly increases bandwidth available for multiprocessor Workstations
PC133 SDRAM Technology
  • Superior memory performance in terms of bandwidth and lower access latency
  • Increases flexibility of system design for memory configurations
  • Proven technology with low cost structure
Workstation Optimized Memory Technology 
(Up to 12-GBytes)
  • High Bandwidth 2-way interleaved architecture achieves up to 2.1 GBytes/s
  • Advanced ECC algorithms that maintain system data integrity
  • Supports a large capacity of memory up to 12-GBytes
  • Supports wide range of memory DIMMs including 64, 128, 256, 512-MByte, and 1, 2-GByte
  • Supports 6-DIMM slots
Advanced "Inter Module Bus" (IMB) Technology
  • Supports 1 GByte/s operation and low latency IO transactions on full duplex, point to point, source synchronous bus.
  • Defined Interconnect from North Bridge to remote PCI IO Bridges
Advanced 64-bit PCI Technology
  • Two full independent 64-bit PCI Buses
  • Maximizes IO bandwidth for the next generation of 64-bit PCI cards
  • Supports up to 2 full 64-bit/66 MHz PCI busses
  • Supports up to 5 64-bit/33 MHz PCI busses
Advanced IO Caching Technology
  • Increases sustainable PCI bus bandwidth by off loading system resources
  • Reduces Front Side bus snoop traffic for enhanced multiprocessing performance
AGP 4X Technology
  • Allows the highest graphics performance currently available
  • Significant increase in bandwidth (2x) to support 3D graphics
Scalable Architecture
  • Increases flexibility of system design for processor, memory, and PCI configurations
  • Strong architectural foundation that enables a smooth transition to the next generation of server technology (i.e. PCI-X, DDR)
Full Peer-to-Peer Support
  • Allows full peer-to-peer transactions between PCI busses
  • Increases options for Intelligent IO and Server Management cards
Integrated IOAPIC
  • Removes the need for a separate IOAPIC chip
  • BOM cost savings, additional board real estate, and increased design flexibility
ATA66
  • Enhances HDD access for faster reads and writes
4 USB Ports
  • Provides the end user with more options to connect peripherals
ServerSet™ III HE-SL Components: Package    ( Silicon Supplier  NEC )
NB6576 North Bridge 3.0HE
  •  Tape Ball Grid Array (TBGA)
SB7440 South Bridge
  •  Plastic Ball Grid Array (PBGA)
IB6555 PCI IO Bridge
  • 352 Plastic Ball Grid Array (PBGA)