|
Features |
Benefits |
|
133 MHz Front Side Bus Capability |
- Supports 100 MHz and 133 MHz system bus for single and
dual processor configurations
- Significantly increases bandwidth available for
multiprocessor Workstations
|
|
PC133 SDRAM Technology |
- Superior memory performance in terms of bandwidth and
lower access latency
- Increases flexibility of system design for memory
configurations
- Proven technology with low cost structure
|
Workstation Optimized Memory Technology
(Up to 12-GBytes) |
- High Bandwidth 2-way interleaved architecture achieves
up to 2.1 GBytes/s
- Advanced ECC algorithms that maintain system data
integrity
- Supports a large capacity of memory up to 12-GBytes
- Supports wide range of memory DIMMs including 64, 128,
256, 512-MByte, and 1, 2-GByte
- Supports 6-DIMM slots
|
|
Advanced "Inter Module Bus" (IMB) Technology |
- Supports 1 GByte/s operation and low latency IO
transactions on full duplex, point to point, source
synchronous bus.
- Defined Interconnect from North Bridge to remote PCI IO
Bridges
|
|
Advanced 64-bit PCI Technology |
- Two full independent 64-bit PCI Buses
- Maximizes IO bandwidth for the next generation of 64-bit
PCI cards
- Supports up to 2 full 64-bit/66 MHz PCI busses
- Supports up to 5 64-bit/33 MHz PCI busses
|
|
Advanced IO Caching Technology |
- Increases sustainable PCI bus bandwidth by off loading
system resources
- Reduces Front Side bus snoop traffic for enhanced
multiprocessing performance
|
|
AGP 4X Technology |
- Allows the highest graphics performance currently
available
- Significant increase in bandwidth (2x) to support 3D
graphics
|
|
Scalable Architecture |
- Increases flexibility of system design for processor,
memory, and PCI configurations
- Strong architectural foundation that enables a smooth
transition to the next generation of server technology
(i.e. PCI-X, DDR)
|
|
Full Peer-to-Peer Support |
- Allows full peer-to-peer transactions between PCI busses
- Increases options for Intelligent IO and Server
Management cards
|
|
Integrated IOAPIC |
- Removes the need for a separate IOAPIC chip
- BOM cost savings, additional board real estate, and
increased design flexibility
|
|
ATA66 |
- Enhances HDD access for faster reads and writes
|
|
4 USB Ports |
- Provides the end user with more options to connect
peripherals
|
|
ServerSet™ III HE-SL Components: |
Package ( Silicon Supplier NEC
) |
|
NB6576 North Bridge 3.0HE |
- Tape Ball Grid Array (TBGA)
|
|
SB7440 South
Bridge |
- Plastic Ball Grid Array (PBGA)
|
| IB6555 PCI IO Bridge |
- 352 Plastic Ball Grid Array (PBGA)
|